coefficient of expansion

[ˌkəʊəˈfɪʃənt ɔv iksˈpænʃən]
  • 释义

    膨胀系数;

数据更新时间:2026-04-18 09:51:45
  • 近义词

  • expansivityn.(可)扩大(或扩展、扩张、延伸、膨胀)性(或度);
1、

Hollow glass bead ( HGB) is a new type of lightweight inorganic non-metallic materials, with the advantages of low density, low thermal conductivity, low coefficient of expansion and high compressive strength.

空心玻璃微珠(HGB)是一种新型的轻质无机非金属材料,具有低密度、低导热系数、低膨胀系数、高抗压强度等优点。

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2、

Two methods are established to predict the thermal expansion coefficient of Unidirectional composite based on micro-mechanics.

基于细观力学方法建立了两种预测单向复合材料的热膨胀系数的方法.

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3、

The LaFe_xNi_ ( 1-x) O_3 thermal coefficient of expansion was measured by PCY model high temperature horizontal expansion apparatus.

利用PCY型材料热膨胀系数测试仪测量了LaFe xNi(1-x)O3系列材料的热膨胀系数。

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4、

The result indicated that thermal coefficient of expansion between layers resulted in the residual stress.

结果表明层间的热膨胀系数差异导致了其间的残余应力,并且应力的分布与厚度比例和温度差有关。

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5、

Water has a variable coefficient of expansion.

水的膨胀系数是可变的.

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6、

The housing has a higher coefficient of expansion than the ring.

壳体比圆环具有较高的膨胀系数.

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7、

Copper, with its extremely high coefficient of expansion, expands more during heating than steel does.

由于铜的膨胀系数特别高, 铜在加热时比钢膨胀得多.

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8、

After jointing, coefficient of expansion leads to remain force.

接合后存在残余应力起因于材料的热膨胀系数.

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9、

A map synthesis of ternary functions based upon Reed-Muller expansion is discussed by the ternary bj coefficient map.

本文使用三值b j系数图,讨论了三值函数RM展开式的图形综合方法。

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10、

The thermal expansion coefficient ( CTE) not only the important performance of materials, but also the important parameter for structure designs.

热膨胀系数不仅是材料的重要使用性能,而且是进行结构设计的关键参数。

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11、

It is suggested that the linear thermal expansion coefficient plays an important role in bonding process through contrast test of anodic bonding between K4 glass and aluminum.

通过K4玻璃与铝片焊接的对比试验,说明材料的线膨胀系数对焊接过程产生了极大的影响。

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12、

Conventional printed wiring boards ( PWBs) are not satisfactory substrates for LCCCs because the mismatch in thermal coefficient of expansion ( TCE) causes solder joints to crack.

普通印制板(PWB)对于无引线陶瓷芯片载体不是满意的基板,因为热膨胀系数(TCE)不匹配能引起铅焊处开裂。

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13、

In contrast with metal and thermoplastic material, which has a higher coefficient of thermal expansion ( CTE).

相较于金属和热塑材料,什么材料具有更高的热膨胀系数(CTE)?

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